Launch Date: February 26, 2025
Manufacturing Process: 4nm (TSMC)
CPU Architecture: Octa-core (4+4)
4x Arm Cortex-A78 @ 2.6 GHz
4x Arm Cortex-A55 @ 2.0 GHz
GPU: Arm Mali-G615 MC2
Architecture: Valhall-based
Features: OpenGL ES 3.2, Vulkan 1.3, OpenCL 2.0
AI Processor: MediaTek NPU 6.0
Features: Advanced AI camera enhancements, low-power edge AI processing
Memory Support:
Type: LPDDR5 / LPDDR4x
Max Frequency: Up to 6400 Mbps
Storage Support: UFS 2.2
Connectivity:
Cellular: 5G R16 modem, 3CC-CA support
Wi-Fi: Tri-band Wi-Fi 6E
Bluetooth: 5.x
Multimedia:
Camera Support: Up to 200MP
Video Recording: 4K @ 30fps HDR
Display Support: Dual display support for foldables and flip phones
HDR Support: Google Ultra HDR
Gaming Features:
MediaTek HyperEngine Gaming Technology 3.0
Enhanced thermal and power efficiency
14%–36% lower power use in gaming workloads vs previous generations
AI Enhancements:
15% AI performance boost over Dimensity 7300
Real-time scene recognition and optimization
Performance Scores (AnTuTu v10):
Total Score: 777,255
CPU: 227,672
GPU: 176,970
Memory: 192,685
UX: 179,928
The MediaTek Dimensity 7400X is a mid-range powerhouse built to deliver premium features like dual-display support, strong AI capabilities, and next-gen gaming performance—ideal for stylish flip and foldable smartphones.
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