The world’s leading chipmaker, Taiwan Semiconductor Manufacturing Company (TSMC), has once again pushed the limits of silicon technology. The company’s upcoming 1.4 nm “A14” (Angstrom-class) process marks a major step forward in the semiconductor race — one that could define computing performance in the next decade.
A New Generation of Fabs
Construction is expected to begin by late 2025, with risk production by 2027 and mass production by 2028.
The project’s cost is staggering industry estimates range from NT$1.2 trillion to NT$1.5 trillion (roughly US $35–45 billion) underlining the immense capital needed to stay at the bleeding edge of chip fabrication.
Performance Targets
●Compared to its 2 nm predecessor, the A14 process promises:
●Up to 15% faster speeds at the same power draw, or
●Up to 30% lower power consumption at the same performance level
●Over 20% transistor density increase
These gains will be powered by TSMC’s second-generation nanosheet GAAFET (Gate-All-Around FET) transistors and a new NanoFlex Pro standard cell architecture both designed to push efficiency and density beyond what FinFET could achieve.
Interestingly, TSMC says it won’t need High-NA EUV lithography for this node, opting to refine current EUV tools instead. That decision could give the company an advantage in cost and process stability compared to rivals still waiting for High-NA adoption.
Ahead of Schedule and the Competition
Reports suggest that early A14 yield performance has already exceeded expectations an encouraging sign for a node still years from mass deployment.
Meanwhile, Samsung has delayed its own 1.4 nm rollout to 2029, and Intel is reportedly reconsidering its 14A roadmap, possibly giving TSMC a multi-year lead in the most advanced process class.
For now, only TSMC’s biggest partners such as Apple, AMD, and Nvidia are expected to access the 1.4 nm node early. Each wafer could cost as much as US $45,000, making it one of the most expensive production nodes in history.
The Strategic Importance
TSMC’s 1.4 nm initiative isn’t just about smaller transistors. It’s a strategic move to preserve Taiwan’s leadership in the global semiconductor ecosystem at a time when AI, defense systems, and high-performance computing are demanding unprecedented power efficiency.
If TSMC maintains its timeline, the first 1.4 nm chips could appear in consumer devices and AI accelerators by 2029, ushering in a new era of computing capability.
In Summary:
TSMC’s 1.4 nm breakthrough represents more than just a technical milestone it’s a statement of dominance in the face of growing competition. Whether this pace can be sustained amid rising costs and global pressure remains to be seen, but one thing is certain: the Angstrom era has begun.
